Substrates for Thick & Thin Film Applications

Laser scribed, drilled and profiled ceramic substrates for the micro-electronics, micro-hybrid, semiconductor, defence and aerospace industries.

Why laser? Most thick and thin film substrates are 96% alumina (Al₂O₃) which is extremely hard and not easily machinable so laser processing is the most efficient way to achieve clean features and tight repeatability.

Miniaturisation, one setup: Thick-film is a miniaturised process where a single substrate often carries many final circuits. With lasering, we scribe, profile, and drill in one setup:

• Scribing: a line of laser pulses removes 30–50% of the material to create controlled break lines so panels snap cleanly into singles.

• Drilling: produces vias between sides of the substrate.

• Profiling: creates complex shapes in the ceramic.

Feature capability: Holes down to 0.06 mm are achievable (material-thickness dependent).

Common thicknesses: 96% alumina at 0.635 mm and 1.0 mm are typical; hybrid circuits are also produced from 0.254 mm up to 1.5 mm.

Laser-Cut Technical Ceramics for Engineering

Drilled and profiled parts for mechanical and engineering applications.

Design freedom: Laser cutting lets you design complex shapes with ease. 96% alumina is hard-wearing and heat absorbing, ideal for:

• Wear parts

• Thermal management

• Electrical management

You’ll find ceramic components across automotive, defence, medical, and even everyday household products.

Cost-effective at any scale: Lasering is economical, there no tooling charges when you order from us, which makes one-offs and prototypes as viable as volume production.

Workable tolerances of ±0.05 mm apply in most thicknesses.

Thick material capability: We cut alumina up to 4 mm thick (stock up to 3 mm).

File formats: CAD/CAM drawings accepted in DXF.